“Opportunities and Applications of Additive Manufacturing”
主讲人：魏军 博士 新加坡制造技术研究院首席科学家
Additive Manufacturing (AM) is defined by ASTM as the "The process of joining materials to make objects from 3D model data, usually layer upon layer, as opposed to subtractive manufacturing methodologies”. Traditional manufacturing has fuelled the industrial revolution that has enabled our world today, yet it contains inherent limitations that point to the need for new approaches. Casting, forming, molding, and machining are complex processes that involve tooling, machinery, computers, and robots. The competitive advantages of AM are geometrical freedom, shortened design to product time, reduction in process steps, mass customization and material flexibility. 3D AM simplifies the laborious process of producing complex parts while reducing cost. It is predisposed to industry sectors that require high mix, low volume parts or customised parts. This presentation will highlight the opportunities and applications of additive manufacturing in a number of growing industry sectors including Aerospace, Transportation, Oil & Gas, Precision Engineering, MedTech, Electronics, Energy and Consumer. In addition, the additive manufacturing research activities in A*STAR/SIMTech will also be introduced.
Dr Wei Jun is currently the Principal Scientist in Singapore Institute of Manufacturing Technology (SIMTech), the Additive Manufacturing Programme Manager for the Agency for Science, Technology and Research (A*STAR) and Programme Manager of Structural Electronics Programme. Dr Wei’s research includes additive manufacturing, flexible and printed electronics. He has authored and co-authored about 700 publications in Chemical Society Reviews, Progress in Materials Science, Science Advances, Advanced Materials, Advanced Functional Materials, ACS Nano, JACS, Energy & Environmental Science, Chemistry of Materials, Journal of Materials Chemistry, Small, Nanoscale, Inorganic Chemistry, Nanotechnology, etc. with citations over 12000 times and H-index of 48. He is holding 70 technology disclosures and patents. He is serving several international conference committees and editorial boards.